EP3SE50F484C3 vs EP3SE50F484C2N Comparación
Comparación detallada lado a lado de EP3SE50F484C3 por Altera y EP3SE50F484C2N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE50F484C3 | EP3SE50F484C2N |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $820,00 | $5.934,83 |
| Device Family | Stratix III E (Enhanced) | — |
| Logic Elements (LE) | 47,500 | — |
| Adaptive Logic Modules (ALM) | 19,000 | — |
| Embedded Memory (M9K + M144K) | 5,760 Kbits | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| User I/Os | 296 | 296 |
| User I/O Banks | [DATA_NEEDED: number of user I/O banks] | — |
| High-Speed Transceivers | [DATA_NEEDED: package-dependent count for 484-FBGA] | — |
| Internal Operating Frequency | Up to 800 MHz | — |
| Process Technology | 40 nm TSMC | 65 nm |
| Speed Grade | C3 (mid) | — |
| Temperatura de funcionamiento | 0C to 85C (Commercial) | 0C to +85C (Commercial) |
| Supply Voltage (Core) | [DATA_NEEDED: nominal core voltage] | — |
| Encapsulado | 484-ball FBGA (FineLine BGA) | 484-ball FCBGA (F484, 23x23 mm, 1.0 mm pitch) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Lead-Free / RoHS | [DATA_NEEDED: lead-free / RoHS status from manufacturer] | — |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Series | — | Stratix III E |
| Family | — | Stratix III E FPGA |
| Logic Elements | — | 47,500 |
| Embedded Memory | — | 2,304 Kbits |
| DSP Blocks (18x18) | — | 264 |
| LABs/CLBs | — | 1,900 |
| Core Voltage | — | 0.9 V / 1.1 V |
| Internal Frequency | — | 600 MHz |
| Estado RoHS | — | Compliant |
| Lead-Free | — | Yes |