EP3SE80F1152C2 vs EP3SE260F1152C2N Comparación
Comparación detallada lado a lado de EP3SE80F1152C2 por Intel y EP3SE260F1152C2N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE80F1152C2 | EP3SE260F1152C2N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.325,00 | $11.000,00 |
| Family | Stratix III E | FPGA - Field Programmable Gate Array |
| Logic Elements | 80,000 | — |
| Logic Array Blocks (LABs) | 3,200 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 6,843,392 | — |
| User I/Os | 744 | — |
| Process Technology | 65 nm | 65 nm |
| Core Voltage (VCCINT) | 1.1 V | — |
| Internal Operating Frequency | up to 600 MHz | — |
| Temperatura de funcionamiento | 0 C to 85 C (Commercial) | [DATA_NEEDED: operating temperature grade] |
| Speed Grade | C2 | — |
| Encapsulado | 1152-ball FC-FBGA (Flip Chip FineLine BGA) | — |
| Package Code | F1152 | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| Series | — | Stratix III E |
| Number of Logic Elements | — | 255000 |
| Number of LABs/CLBs | — | 10200 |
| Total Memory Bits | — | 16672768 |
| Number of I/O | — | 744 |
| Voltage - Supply | — | 1.1 V |
| Encapsulado / Carcasa | — | 1152-BBGA, FCBGA |
| Maximum Frequency | — | 600 MHz |
| Supplier Device Package | — | 1152-FCBGA |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |
| Lead Free | — | Yes (per EP3SE260F1152C2G comparison) |
| ECCN | — | [DATA_NEEDED: ECCN code] |
| Moisture Sensitivity | — | [DATA_NEEDED: MSL level] |