EP3SE80F1152C3 vs EP3SE80F1152I3N Comparación
Comparación detallada lado a lado de EP3SE80F1152C3 por Intel y EP3SE80F1152I3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3SE80F1152I3N - Stratix III E FPGA 80K LE, 1152-FCBGA | Intel
EP3SE80F1152I3N ⚠ Última compraComparación de especificaciones
| Parámetro | EP3SE80F1152C3 | EP3SE80F1152I3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.880,00 | $1.395,00 |
| Device Family | Stratix III E | — |
| Logic Elements | 80,000 | 80,000 |
| Logic Array Blocks (LABs) | 3,200 | 3,200 |
| User I/Os | 744 | — |
| Embedded Memory | 6,843,392 bits | — |
| Internal Frequency | 800 MHz | — |
| Maximum DSP Block Frequency | 717 MHz | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Supply Voltage | 1.1 V | — |
| Speed Grade | C3 | I3 |
| Temperatura de funcionamiento | 0 to 85 C (Commercial) | -40 °C to +100 °C (Industrial) |
| Encapsulado | FBGA-1152, 35x35 mm | 1152-ball FCBGA (Flip-Chip BGA) |
| Transceivers | 12 full-duplex channels (family-dependent) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant (per distributor listing) | [DATA_NEEDED: rohs status] |
| Design Software | Quartus II | — |
| Family | — | Stratix III E |
| Embedded Memory Bits | — | 6,843,392 |
| Maximum User I/O | — | 744 |
| Core Voltage | — | 1.1 V |
| Auxiliary Supply Voltages | — | 1.2 V, 3.3 V |
| Maximum Internal Clock Frequency | — | 500 MHz |
| Configuration Mode | — | JTAG / Passive Serial / Fast Passive Parallel |
| Configuration Encryption | — | AES-128 bitstream encryption supported |