EP3SL200H780I3 vs EP3SL200H780C3 Comparación
Comparación detallada lado a lado de EP3SL200H780I3 por Intel y EP3SL200H780C3 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SL200H780I3 | EP3SL200H780C3 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $7.980,00 | $5.900,00 |
| Series | Stratix III L | Stratix III L |
| Family | Stratix III | — |
| Logic Elements | 200,000 | 200,000 |
| LABs (Logic Array Blocks) | 8000 | — |
| Total RAM Bits | 10,901,504 (10,900 Kb) | — |
| User I/O Count | 488 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | — |
| Embedded Multipliers (DSP blocks) | 384 (18x18) | — |
| PLLs | 12 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 717 MHz | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | Commercial grade (0C to +85C, exact range [DATA_NEEDED]) |
| Encapsulado | 780-BBGA, FCBGA (HBGA-780) | 780-ball FCBGA (H780) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Supplier Device Package | 780-FBGA (29x29 mm) | — |
| Lead-Free / RoHS | Compliant (lead-free) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Device | — | EP3SL200 |
| Logic Array Blocks (LABs) | — | 8,000 |
| User I/O Pins | — | 488 |
| Embedded Memory Bits | — | 10,901,520 |
| Speed Grade | — | 3 (slowest of Stratix III bins) |
| Nivel MSL | — | 3 (168 Hours) |
| Sub-Family | — | Stratix III L (lower-power logic variant) |
| Transceivers | — | [DATA_NEEDED: count and speed] |
| DSP Blocks | — | [DATA_NEEDED: count] |
| Estado RoHS | — | [DATA_NEEDED: confirmed in datasheet] |
| Lead-Free / Halogen-Free | — | [DATA_NEEDED] |