EP3SL200H780I3 vs EP3SL200H780C4 Comparación
Comparación detallada lado a lado de EP3SL200H780I3 por Intel y EP3SL200H780C4 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SL200H780I3 | EP3SL200H780C4 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $7.980,00 | $1.210,00 |
| Series | Stratix III L | Stratix III L |
| Family | Stratix III | — |
| Logic Elements | 200,000 | 200,000 |
| LABs (Logic Array Blocks) | 8000 | — |
| Total RAM Bits | 10,901,504 (10,900 Kb) | 10,901,504 |
| User I/O Count | 488 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | — |
| Embedded Multipliers (DSP blocks) | 384 (18x18) | — |
| PLLs | 12 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 717 MHz | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | 0C to +85C (commercial) |
| Encapsulado | 780-BBGA, FCBGA (HBGA-780) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Supplier Device Package | 780-FBGA (29x29 mm) | 780-FCBGA |
| Lead-Free / RoHS | Compliant (lead-free) | — |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Number of LABs/CLBs | — | 8000 |
| Number of I/O | — | 488 |
| Number of Gates | — | [DATA_NEEDED: total gate count not in source data] |
| Voltage - Supply | — | 0.9 V (core), 1.1 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V (I/O) |
| Internal Operating Frequency | — | Up to 800 MHz |
| Encapsulado / Carcasa | — | 780-BBGA, FCBGA |
| Process Node | — | 40 nm TSMC |
| Multiplier Count (9-bit) | — | 488 |
| Estado RoHS | — | Compliant (lead-free) |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |