EP3SL50F780I3 vs EP3SL70F780I3 Comparación
Comparación detallada lado a lado de EP3SL50F780I3 por Intel y EP3SL70F780I3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SL50F780I3 | EP3SL70F780I3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $632,63 | $1.096,81 |
| Series | Stratix III L | — |
| Logic Elements | 47,500 | 67,500 |
| Logic Array Blocks (LABs) | 1,900 | — |
| User I/O Pins | 488 | — |
| Total Memory Bits | 2,106 Kbit (M9K + M144K) | — |
| Transceiver Channels | 16 (up to 3.75 Gbps) + 8 (up to 6.5 Gbps) | — |
| Encapsulado | 780-ball FC-FBGA (FineLine BGA), 1 mm pitch | 780-ball FineLine BGA (FC-FBGA), 28x28 mm |
| Process Technology | 65 nm | — |
| Core Voltage | Selectable 1.1 V / 0.9 V | 1.1 V |
| Speed Grade | I3 (industrial, third-fastest bin) | I3 (industrial) |
| Temperatura de funcionamiento | -40C to +100C (industrial) | -40 C to +100 C (Industrial) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead Free | Yes | — |
| Vertical Migration | Drop-in to EP3SL70 in 780-FBGA package | — |
| Family | — | Stratix III L |
| Embedded Memory Bits | — | 2,699,264 bits |
| Maximum User I/O | — | 488 |
| Process Node | — | 65 nm |
| Package Code | — | BGA780,28X28,40 |
| Configuration Mode | — | JTAG IEEE 1149.1, Passive Serial, Active Serial |
| Number of Terminals | — | 780 |
| Supplier Device Package | — | 780-BBGA, FCBGA |