EP3SL70F484C4N vs EP3SL70F484C4L Comparación
Comparación detallada lado a lado de EP3SL70F484C4N por Intel y EP3SL70F484C4L por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SL70F484C4N | EP3SL70F484C4L |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $580,00 | $985,00 |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | — |
| Adaptive Logic Modules (ALMs) | 33,880 | — |
| LABs/CLBs | 2,700 | — |
| Number of Logic Cells / Gates | 67,500 | — |
| Embedded Memory (Block RAM) | 2,699,264 bits (2.7 Mbit) | — |
| Number of I/Os | 296 | — |
| Number of Transceivers | [DATA_NEEDED: number of embedded transceivers] | — |
| Core Voltage | 1.1 V | 0.9 V |
| Process Technology | 65 nm | 65 nm |
| Speed Grade | -C4 | — |
| Temperatura de funcionamiento | 0C to +85C (Commercial, TJ) | — |
| Package Type | 484-ball FCBGA (FineLine BGA) | — |
| Package Code | F484 | — |
| Ball Pitch | 1.0 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Configuration Mode | JTAG, Passive Serial, Fast Passive Parallel, Host Bus | — |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | 3 | 3 (168 hours) |
| Logic Elements (LE) | — | 67,500 |
| Embedded Memory (Bits) | — | 2,699,264 |
| Logic Array Blocks (LABs) | — | 2,700 |
| User I/O Count | — | 296 |
| Operating Frequency (Max) | — | 375 MHz |
| Encapsulado | — | 484-ball FC-FBGA (FBGA-484) |
| Configuration Memory | — | SRAM-based |
| Operating Temperature Grade | — | Commercial (C4) |
| Lead-Free | — | Yes |
| Shipping Form | — | Tray |