EP3SL70F780C2N vs EP3SL70F780I3 Comparación
Comparación detallada lado a lado de EP3SL70F780C2N por Intel y EP3SL70F780I3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SL70F780C2N | EP3SL70F780I3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $139,00 | $1.096,81 |
| Family | Stratix III L | Stratix III L |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 67,500 | 67,500 |
| Logic Array Blocks (LABs) | 2,700 | — |
| Embedded Memory Bits | 2,699,264 | 2,699,264 bits |
| Embedded Memory Type | M9K blocks | — |
| User I/Os | 488 | — |
| Process Technology | 65 nm CMOS, low-power variant | — |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Logic Performance | 600 MHz | — |
| Encapsulado | 780-ball FC-FBGA (FineLine BGA) | 780-ball FineLine BGA (FC-FBGA), 28x28 mm |
| Package Pin Count | 780 | — |
| Speed Grade | C2 (commercial, -2 speed bin) | I3 (industrial) |
| Operating Temperature Grade | N suffix - standard commercial/other | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant (per DigiKey listing) | [DATA_NEEDED: RoHS status] |
| Maximum User I/O | — | 488 |
| Temperatura de funcionamiento | — | -40 C to +100 C (Industrial) |
| Process Node | — | 65 nm |
| Package Code | — | BGA780,28X28,40 |
| Configuration Mode | — | JTAG IEEE 1149.1, Passive Serial, Active Serial |
| Number of Terminals | — | 780 |
| Supplier Device Package | — | 780-BBGA, FCBGA |