EP4CE55F29C6 vs EP4CE55F29C8N Comparación
Comparación detallada lado a lado de EP4CE55F29C6 por Intel y EP4CE55F29C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE55F29C6 | EP4CE55F29C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $154,20 | $285,00 |
| Family | Cyclone IV E | Cyclone IV E |
| Series | Cyclone IV E | — |
| Logic Elements (LE) | 55,856 | 55,856 |
| Logic Array Blocks (LAB) | 47 | — |
| Embedded Memory | 2,396,160 bits (234 Kb) | 2,340 Kbits |
| Memory Blocks (M9K) | 156 | — |
| Embedded 18x18 Multipliers | 156 | — |
| User I/O Pins | 374 | — |
| PLLs | 4 | 4 to 8 (per device) |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 60 nm (low-power) | 60 nm (TSMC low-power) |
| Temperatura de funcionamiento | Commercial (0C to +85C) | — |
| Encapsulado | 780-ball FBGA (29 mm x 29 mm) | 780-ball FBGA (F29) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Configuration Modes | AS, AP, PS, JTAG | — |
| Bitstream Encryption | AES-128 (optional) | — |
| Estado RoHS | Compliant | Compliant |
| Embedded Multiplier Blocks (18x18) | — | 154 |
| Maximum User I/O Pins | — | 374 |
| Logic Array Blocks (LABs) | — | 3,491 |
| Speed Grade | — | 8 (commercial) |
| Temperature Grade | — | Commercial (0 C to +85 C) |
| Configuration Method | — | SRAM-based, volatile (requires external config device) |
| Lead-Free / Halogen-Free | — | Yes (per part marking) |