EP4CE55F29I8LN vs EP4CE55F29I8L Comparación
Comparación detallada lado a lado de EP4CE55F29I8LN por Intel y EP4CE55F29I8L por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE55F29I8LN | EP4CE55F29I8L |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $165,00 | $131,42 |
| Family | Cyclone IV E | Cyclone IV E |
| Device Model | EP4CE55 | — |
| Logic Elements (LEs) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,135 | 3,435 |
| Total Embedded Memory Bits | 2,396,160 bits | — |
| Embedded Memory (M9K blocks) | 260 blocks | — |
| 18x18 Hardware Multipliers | 374 | — |
| PLLs | 4 | 4 |
| Maximum User I/O Pins | 374 | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 60 nm TSMC low-power | 60 nm low-power |
| Encapsulado | 780-ball FBGA (F29) | 780-FBGA (FineLine BGA), 29x29 mm |
| Ball Pitch | 1.0 mm | — |
| Temperatura de funcionamiento | -40C to +85C (Industrial) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (per OPN suffix N) | — |
| Configuration Modes | JTAG, AS, PS, FPP | Passive Serial, Fast Passive Parallel, Active Serial, JTAG |
| Supported I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| Device Logic Elements | — | 55,856 |
| Embedded Memory Bits | — | 2,396,160 bits |
| Embedded 18x18 Multipliers | — | 156 |
| Maximum User I/Os | — | 374 |
| Global Clock Networks | — | 20 |
| Core Voltage VCCINT | — | 1.0 V / 1.2 V |
| Auxiliary Voltage VCCAUX | — | 2.5 V |
| I/O Voltage VCCIO | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Operating Temperature (Industrial) | — | -40C to +100C junction |
| Speed Grade | — | 8 |
| Estado RoHS | — | Compliant |