EP4CE6E22C8 vs EP4CE6E22C6 Comparación
Comparación detallada lado a lado de EP4CE6E22C8 por Intel y EP4CE6E22C6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE6E22C8 | EP4CE6E22C6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $13,65 | $12,05 |
| Device Family | Cyclone IV E | — |
| Logic Elements (LEs) | 6,272 | — |
| Logic Array Blocks (LABs) | 392 | 392 LABs |
| Embedded Memory (Kbits) | 270 | — |
| Embedded 18x18 Multipliers | 15 | 15 |
| PLLs | 2 | 2 |
| Maximum User I/Os | 91 | 91 |
| Encapsulado | EQFP-144 (E22), 22 x 22 mm, 0.5 mm pitch | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | — |
| Temperatura de unión de funcionamiento | 0C to +85C (commercial) | — |
| Speed Grade | C8 (-8 corner) | C6 |
| Maximum Internal Clock Frequency | [DATA_NEEDED: max fMAX per logic] | — |
| Configuration Modes | JTAG, Active Serial (EPCS), Passive Serial | — |
| Process Technology | 60 nm low-power CMOS | TSMC 60 nm low-k |
| Estado RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / [DATA_NEEDED: halogen-free status] | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Family | — | Cyclone IV E |
| Device Logic Elements | — | 6,272 LE |
| Total RAM Bits | — | 270 Kbit |
| Core Voltage | — | 1.2 V |
| Temperatura de funcionamiento | — | 0 °C to +85 °C (Commercial) |
| Package Type | — | 144-pin EQFP (Enhanced QFP, exposed pad) |
| Package Dimensions | — | 22 mm × 22 mm |
| Lead Pitch | — | 0.5 mm |
| Configuration Method | — | SRAM-based (volatile); JTAG, Active Serial, Passive Serial |