EP4CE6E22I7N vs EP4CE6E22I8L Comparación
Comparación detallada lado a lado de EP4CE6E22I7N por Intel y EP4CE6E22I8L por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE6E22I7N | EP4CE6E22I8L |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $11,85 | $11,50 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LEs) | 6,272 | 6272 |
| Configurable Logic Blocks (CLBs) | 392 | — |
| Embedded Memory (RAM) | 270 Kbits | — |
| User Flash Memory | 4 Kbits | — |
| User I/O Pins | 91 | — |
| PLLs (General-Purpose) | 2 | — |
| Global Clock Networks | Up to 20 | — |
| Process Technology | 60 nm (TSMC low-power) | 60 nm |
| Core Voltage (VCCINT) | 1.0 V to 1.2 V (nominal 1.2 V) | — |
| Operating Temperature (I7 grade) | -40C to +100C (junction) | — |
| Maximum Operating Frequency | Up to 472.5 MHz | — |
| Encapsulado | 144-pin EQFP (Plastic Enhanced QFP) with exposed pad | 144-LQFP Exposed Pad (EQFP-144) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration Method | Serial (EPCS) or JTAG | — |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Nivel MSL | 3 (per JEDEC J-STD-020) | — |
| Estado RoHS | Compliant | Compliant |
| Total RAM Bits | — | 276480 |
| Number of I/O | — | 91 |
| Number of Logic Array Blocks (LABs) | — | 392 |
| Frecuencia de reloj máxima | — | 362 MHz |
| Core Supply Voltage | — | 1.2 V |
| I/O Supply Voltage | — | 2.5 V / 3.3 V |
| Package Dimensions | — | 22 x 22 mm, 0.5 mm pitch |
| Rango de temperatura de funcionamiento | — | -40°C to +100°C (industrial) |
| Speed Grade | — | 8 |