EP4CE6F17C6 vs EP4CE6F17C8L Comparación
Comparación detallada lado a lado de EP4CE6F17C6 por Intel y EP4CE6F17C8L por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE6F17C6 | EP4CE6F17C8L |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $12,10 | $11,10 |
| Family | Cyclone IV E | — |
| Logic Elements (LE) | 6,272 | — |
| Configurable Logic Blocks (CLB) | 392 | — |
| Embedded Memory | 276,480 bits | — |
| Embedded 18x18 Multipliers | 15 | — |
| PLLs | 2 | 4 |
| Maximum User I/O | 179 | — |
| Encapsulado | 256-FBGA 17x17 mm, 1.0 mm pitch | — |
| Speed Grade | C6 (commercial) | C8 (commercial speed grade 8) |
| Temperatura de unión de funcionamiento | 0°C to 85°C | — |
| Core Voltage VCCINT | 1.2 V (typical) | — |
| Process Node | 60 nm low-power | — |
| I/O Banks | 8 | — |
| Memory Blocks | M9K (30 blocks) | — |
| Configuration Mode | Active Serial (AS), Passive Serial (PS), JTAG | — |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount (FBGA) | Surface Mount |
| Nivel MSL | 3 (168 hours) | 3 (per JEDEC J-STD-020) |
| Series | — | Cyclone IV E |
| Logic Elements / Cells | — | 6,272 |
| Number of CLBs | — | 392 |
| Number of Logic Elements / Cells | — | 6,272 |
| Total RAM Bits | — | 270,000 |
| Number of I/O | — | 179 max |
| Number of Gates | — | [DATA_NEEDED: gate count for EP4CE6] |
| Voltage - Supply | — | 1.0 V core, 2.5 V / 3.3 V I/O |
| Temperatura de funcionamiento | — | 0C to +85C (commercial, L grade) |
| Encapsulado / Carcasa | — | 256-LBGA, 17 x 17 mm, 1.0 mm pitch (F17) |
| Number of LABs/CLBs | — | 392 |
| Embedded Multipliers (18x18) | — | 15 |
| Configuration Memory | — | External (EPCS / EPCQ serial flash) |