EP4CE6F17C9L vs EP4CE6F17C6 Comparación
Comparación detallada lado a lado de EP4CE6F17C9L por Intel y EP4CE6F17C6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE6F17C9L | EP4CE6F17C6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $15,60 | $12,10 |
| Series | Cyclone IV E | — |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 6,272 | 6,272 |
| Embedded Memory Bits | 276,480 | — |
| Maximum User I/O Pins | 179 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| Embedded Multipliers (18x18) | 15 | — |
| PLLs | 2 | 2 |
| Global Clock Networks | 10 | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Temperatura de unión de funcionamiento | 0C to 85C (commercial) | 0°C to 85°C |
| Encapsulado | 256-ball FBGA (F17), 17x17 mm, 1.0 mm pitch | 256-FBGA 17x17 mm, 1.0 mm pitch |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (FBGA) |
| Process Technology | 60 nm | — |
| Configuration Mode | AS, PS, JTAG | Active Serial (AS), Passive Serial (PS), JTAG |
| Nivel MSL | [DATA_NEEDED: MSL level] | 3 (168 hours) |
| Estado RoHS | Compliant (lead-free FBGA) | Compliant |
| Configurable Logic Blocks (CLB) | — | 392 |
| Embedded Memory | — | 276,480 bits |
| Embedded 18x18 Multipliers | — | 15 |
| Maximum User I/O | — | 179 |
| Speed Grade | — | C6 (commercial) |
| Core Voltage VCCINT | — | 1.2 V (typical) |
| Process Node | — | 60 nm low-power |
| I/O Banks | — | 8 |
| Memory Blocks | — | M9K (30 blocks) |