EP4CE75F23I8L vs EP4CE115F23I8LN Comparación
Comparación detallada lado a lado de EP4CE75F23I8L por Intel y EP4CE115F23I8LN por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE75F23I8L | EP4CE115F23I8LN |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $213,30 | $198,75 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 75,408 | 114,480 |
| Embedded Memory (bits) | 2,810,880 | 3,981,312 |
| Number of M9K Memory Blocks | 305 | — |
| Embedded 18x18 Multipliers | 274 | 66 |
| User I/O Pins | 292 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/O | 292 | — |
| Encapsulado | 484-ball FBGA | 484-FBGA (23x23 mm, 1.0 mm pitch) |
| Temperatura de funcionamiento | -40C to +85C (Industrial) | -40C to +100C (Industrial) |
| Supply Voltage (Core) | 1.0 V / 1.2 V | — |
| I/O Standards Supported | LVDS, SSTL, HSTL, LVPECL, LVCMOS, LVTTL | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Process Node | 60 nm low-leakage | — |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | 3 | [DATA_NEEDED: MSL level] |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Device | — | EP4CE115 |
| Logic Array Blocks (LABs/CLBs) | — | 7,155 |
| General-purpose PLLs | — | 4 |
| User I/O Count | — | 280 |
| Process Technology | — | 60 nm |
| Core Voltage (VCCINT) | — | 1.0 V / 1.2 V |
| Lead-Free | — | Yes |