EP4CGX110DF27C7N vs EP4CGX50DF27C7N Comparación
Comparación detallada lado a lado de EP4CGX110DF27C7N por Intel y EP4CGX50DF27C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX110DF27C7N | EP4CGX50DF27C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $204,20 | $58,60 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Cyclone IV GX | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 109,424 | — |
| Total RAM Bits | 5,621,760 (686 Kbytes) | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| Maximum User I/Os | 393 | — |
| Number of Transceivers | 8 | — |
| Transceiver Data Rate | up to 3.125 Gbps | — |
| Number of PLLs | 4 | — |
| Process Technology | 60 nm | — |
| Core Supply Voltage | 1.2 V | 1.2 V |
| I/O Supply Voltage | 1.2 V to 3.3 V (multi-voltage) | — |
| Rango de temperatura de funcionamiento | 0C to +85C (commercial) | — |
| Encapsulado | 672-ball FBGA (F27) | 672-pin FBGA (FineLine BGA) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration Memory | External serial flash (active serial) | — |
| Estado RoHS | Compliant | Compliant |
| Family | — | Cyclone IV GX |
| Logic Elements (LE) | — | 49,888 |
| Logic Array Blocks (LAB) | — | [DATA_NEEDED: LAB count for EP4CGX50] |
| Total Embedded Memory Bits | — | 2,562,048 |
| User I/O Pins (max) | — | 310 |
| Transceivers | — | Yes (3.125 Gbps GX channels, package-dependent) |
| Process Node | — | 60 nm |
| Operating Temperature (Commercial 'C') | — | 0C to +85C |
| PLL Count | — | 6 |
| Hard Memory Controller | — | DDR/DDR2/DDR3/QDRII/RLDRAM PHY |
| Lead-Free | — | Yes |