EP4CGX110DF27I7N vs EP4CGX150DF27I7NAF Comparación
Comparación detallada lado a lado de EP4CGX110DF27I7N por Intel y EP4CGX150DF27I7NAF por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX110DF27I7N | EP4CGX150DF27I7NAF |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $198,00 | $218,50 |
| Series | Cyclone IV GX | — |
| Device Family | EP4CGX110 | — |
| Logic Elements (LEs) | 109,424 | — |
| Logic Array Blocks (LABs) | 6,422 | — |
| Embedded Memory (bits) | 5,621,760 | — |
| Memory Blocks (M9K) | 610 | — |
| Embedded 18x18 Multipliers | 280 | — |
| User I/Os | 393 | 393 |
| Transceivers | 8 channels, up to 3.125 Gbps | 8 channels up to 3.125 Gbps |
| PCIe Hard IP Blocks | 4 (Gen1 x1/x2/x4) | — |
| PLLs | 4 | 8 |
| Core Voltage | 1.2 V | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Encapsulado | 672-ball FBGA, 1.0 mm pitch | 672-ball FineLine BGA |
| Tipo de montaje | Surface Mount | — |
| Estado RoHS | Compliant | Compliant |
| Process Node | 60 nm | — |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| Family | — | Cyclone IV GX |
| Logic Elements (LE) | — | 149,760 |
| Embedded Memory Bits | — | 6,635,520 bits |
| Embedded Memory Blocks (M9K) | — | 720 |
| Global Clock Networks | — | 20 |
| Process Technology | — | 60 nm |
| Speed Grade | — | 7 |
| Temperature Grade | — | Industrial (I) |
| Configuration Support | — | AS, PS, JTAG, AES bitstream encryption |
| Hard Memory Controllers | — | 2 (DDR / DDR2 SDRAM) |
| Hard Multipliers (18x18) | — | 360 |
| PCIe Hard IP | — | PCIe Gen1 x1 / x2 / x4 |