EP4CGX150CF23I7 vs EP4CGX110CF23I7 Comparación
Comparación detallada lado a lado de EP4CGX150CF23I7 por Intel y EP4CGX110CF23I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX150CF23I7 | EP4CGX110CF23I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $192,00 | $338,55 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 149,760 | — |
| Embedded Memory | 6,635,520 bits (6480 Kbits / 720 Kbits per M9K block) | — |
| DSP Blocks (18x18 Multipliers) | 360 | — |
| Maximum User I/O Pins | 270 | — |
| Transceivers | 8 channels, up to 3.125 Gbps | 8 channels up to 3.125 Gbps |
| PCIe Hard IP | 1 Gen1 x4 controller | — |
| PLLs | 4 user PLLs + 4 transceiver PLLs | 8 |
| Process Technology | 60 nm low-power CMOS | 60 nm low-power |
| Core Supply Voltage | 1.2 V | — |
| Speed Grade | I7 (industrial, fast) | — |
| Temperatura de funcionamiento | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Encapsulado | 484-pin Fine-pitch BGA (FBGA-484, F23) | 484-pin FBGA (F23) |
| Tipo de montaje | Surface Mount (BGA) | — |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | 3 (per JEDEC J-STD-020) | — |
| Logic Elements (LE) | — | 109,424 |
| Logic Array Blocks (LAB) | — | [DATA_NEEDED: LAB count] |
| Embedded Memory Bits | — | 5,621,760 bits |
| M9K Memory Blocks | — | [DATA_NEEDED: M9K block count] |
| Embedded 18x18 Multipliers | — | 66 |
| User I/O | — | 270 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Lead-Free | — | Yes |