EP4CGX150CF23I7 vs EP4CGX110CF23I7N Comparación
Comparación detallada lado a lado de EP4CGX150CF23I7 por Intel y EP4CGX110CF23I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX150CF23I7 | EP4CGX110CF23I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $192,00 | $1.650,08 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 149,760 | 109,424 |
| Embedded Memory | 6,635,520 bits (6480 Kbits / 720 Kbits per M9K block) | 5,621,760 bits |
| DSP Blocks (18x18 Multipliers) | 360 | — |
| Maximum User I/O Pins | 270 | — |
| Transceivers | 8 channels, up to 3.125 Gbps | — |
| PCIe Hard IP | 1 Gen1 x4 controller | — |
| PLLs | 4 user PLLs + 4 transceiver PLLs | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Core Supply Voltage | 1.2 V | — |
| Speed Grade | I7 (industrial, fast) | I7 (industrial, balance of speed and power) |
| Temperatura de funcionamiento | -40C to +100C (industrial) | -40 °C to +100 °C (industrial, inferred from 'I') |
| Encapsulado | 484-pin Fine-pitch BGA (FBGA-484, F23) | FBGA-484 (484-pin FineLine BGA) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | Compliant | — |
| Nivel MSL | 3 (per JEDEC J-STD-020) | — |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Configurable Logic Blocks (CLBs / LABs) | — | 6,839 |
| User I/O Count | — | 270 |
| Supply Voltage (Core) | — | 1.2 V |
| Package Body Size | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Maximum Operating Frequency | — | 472.5 MHz |
| Lead-Free / RoHS | — | Yes (N suffix) |