EP4CGX150CF23I7 vs EP4CGX150CF23C7N Comparación
Comparación detallada lado a lado de EP4CGX150CF23I7 por Intel y EP4CGX150CF23C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP4CGX150CF23C7N - Cyclone IV GX FPGA 149760 LE FBGA-484 | Intel / Altera
EP4CGX150CF23C7N ✓ ActivoComparación de especificaciones
| Parámetro | EP4CGX150CF23I7 | EP4CGX150CF23C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $192,00 | $138,95 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 149,760 | 149760 |
| Embedded Memory | 6,635,520 bits (6480 Kbits / 720 Kbits per M9K block) | — |
| DSP Blocks (18x18 Multipliers) | 360 | — |
| Maximum User I/O Pins | 270 | — |
| Transceivers | 8 channels, up to 3.125 Gbps | 8 channels |
| PCIe Hard IP | 1 Gen1 x4 controller | — |
| PLLs | 4 user PLLs + 4 transceiver PLLs | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Core Supply Voltage | 1.2 V | — |
| Speed Grade | I7 (industrial, fast) | — |
| Temperatura de funcionamiento | -40C to +100C (industrial) | Commercial (0C to +85C) |
| Encapsulado | 484-pin Fine-pitch BGA (FBGA-484, F23) | FBGA-484 (23 x 23 mm, 1.0 mm pitch) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant (lead-free) |
| Nivel MSL | 3 (per JEDEC J-STD-020) | — |
| Logic Array Blocks | — | 9360 |
| Embedded Memory (RAM bits) | — | 6635520 (6.635 Mbit) |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| User I/O | — | 270 |
| Transceiver Data Rate | — | 3.125 Gbps |
| Maximum Operating Frequency | — | 472.5 MHz |
| PLL Count | — | 4 |
| Core Voltage | — | 1.2 V |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| Design Software | — | Quartus Prime |