EP4CGX150DF27C6N vs EP4CGX150DF27C8N Comparación
Comparación detallada lado a lado de EP4CGX150DF27C6N por Intel y EP4CGX150DF27C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP4CGX150DF27C6N - 149760 Cells, 3.125 Gbps Transceiver FPGA | Intel
EP4CGX150DF27C6N ✓ ActivoIntel
EP4CGX150DF27C8N - Cyclone IV GX FPGA, 149760 Cells, 672-FBGA | Intel
EP4CGX150DF27C8N ✓ ActivoComparación de especificaciones
| Parámetro | EP4CGX150DF27C6N | EP4CGX150DF27C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $205,00 | $305,00 |
| Family | Cyclone IV GX | — |
| Logic Elements | 149,760 | — |
| Process Technology | 60 nm | — |
| Core Supply Voltage | 1.2 V (range 1.16 V to 1.24 V) | — |
| Encapsulado | 672-ball FBGA (F27) | 672-ball FineLine BGA (FBGA), 27 x 27 mm, 1.0 mm pitch |
| Transceivers | 8 high-speed serial channels up to 3.125 Gbps | 8 high-speed serial channels |
| Total Memory Bits | [DATA_NEEDED: total memory bits] | — |
| User I/O Pins | [DATA_NEEDED: user I/O count for F27 package] | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | 9,360 |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | [DATA_NEEDED: 18x18 multiplier count] |
| PCIe Hard IP | Yes, Gen1 x1/x2/x4 | — |
| Speed Grade | C6 (commercial) | C8 (-8, slowest in commercial temp range) |
| Temperatura de funcionamiento | Commercial (0C to +85C) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Pin/Ball Count | 672 | — |
| Device Family | — | Cyclone IV GX |
| Series | — | EP4CGX150 |
| Logic Elements (LEs) | — | 149,760 |
| Embedded Memory Bits | — | 6,635,520 |
| Maximum User I/O Pins | — | 393 |
| Transceiver Data Rate | — | Up to 3.125 Gbps |
| Core Process Technology | — | 60 nm |
| Supply Voltage (Core) | — | 1.2 V |
| Temperatura de unión de funcionamiento | — | 0 C to +85 C (commercial) |
| Lead Free / RoHS | — | Lead free, RoHS compliant |
| PLL Count | — | [DATA_NEEDED: PLL count] |