EP4CGX150DF27I7N vs EP4CGX150DF27I7 Comparación
Comparación detallada lado a lado de EP4CGX150DF27I7N por Intel y EP4CGX150DF27I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX150DF27I7N | EP4CGX150DF27I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $175,60 | $460,00 |
| Series | Cyclone IV GX | — |
| Device Family | EP4CGX150 | Cyclone IV GX |
| Logic Elements (LE) | 149,760 | — |
| Embedded Memory Bits | 6,635,520 bits | 6,635,520 (M9K blocks) |
| Embedded Memory Blocks | 720 M9K blocks | — |
| User I/O Pins | 393 | — |
| Embedded 18x18 Multipliers | 720 | — |
| Transceivers | 8 (up to 3.125 Gbps) | Up to 8 channels, 3.125 Gbps |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| Process Technology | 60 nm low-power CMOS | 60 nm low-power |
| Core Supply Voltage | 1.2 V (typical) | 1.2 V |
| Temperatura de funcionamiento | -40 C to +100 C (industrial, 'I' grade) | — |
| Speed Grade | 7 | 7 |
| Encapsulado | 672-ball FBGA (F27), 27x27 mm, 1.0 mm pitch | 672-ball FBGA (F27, 1.0 mm pitch) |
| Tipo de montaje | Surface Mount (BGA) | — |
| Lead-Free / RoHS | Yes (suffix N) | — |
| Configuration Mode | JTAG / Active Serial / Passive Serial | — |
| Logic Elements (LEs) | — | 149,760 |
| Embedded Multipliers (18x18) | — | 720 |
| User I/O Count | — | 393 |
| Hard Memory Controller | — | Yes |
| Hard PCI Express | — | Yes (x1 / x2 Gen1) |
| Temperatura de unión de funcionamiento | — | -40 °C to +100 °C (industrial) |
| Configuration Scheme | — | Active serial / passive serial / JTAG |
| Estado RoHS | — | Compliant |
| Lead-Free | — | Yes |