EP4CGX150DF27I7N vs EP4CGX75DF27C6 Comparación
Comparación detallada lado a lado de EP4CGX150DF27I7N por Intel y EP4CGX75DF27C6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX150DF27I7N | EP4CGX75DF27C6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $175,60 | $109,20 |
| Series | Cyclone IV GX | — |
| Device Family | EP4CGX150 | — |
| Logic Elements (LE) | 149,760 | — |
| Embedded Memory Bits | 6,635,520 bits | 4,257,792 |
| Embedded Memory Blocks | 720 M9K blocks | — |
| User I/O Pins | 393 | — |
| Embedded 18x18 Multipliers | 720 | — |
| Transceivers | 8 (up to 3.125 Gbps) | Integrated (3.125 Gbps) |
| PLLs | [DATA_NEEDED: PLL count] | Yes (periphery and global) |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| Process Technology | 60 nm low-power CMOS | 60 nm CMOS |
| Core Supply Voltage | 1.2 V (typical) | 1.2 V |
| Temperatura de funcionamiento | -40 C to +100 C (industrial, 'I' grade) | — |
| Speed Grade | 7 | 6 |
| Encapsulado | 672-ball FBGA (F27), 27x27 mm, 1.0 mm pitch | 672-ball FBGA |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Lead-Free / RoHS | Yes (suffix N) | — |
| Configuration Mode | JTAG / Active Serial / Passive Serial | — |
| Family | — | Cyclone IV GX |
| Device Logic Elements | — | 73,920 |
| Maximum User I/O | — | 310 |
| Package Code | — | F27 (672-FBGA) |
| Embedded Multipliers (18x18) | — | 274 |
| PCIe Hard IP | — | Yes (Gen1) |
| Configuration Modes | — | JTAG, Active Serial, Passive Serial |
| Operating Temperature Grade | — | Commercial |
| Estado RoHS | — | Compliant |