EP4CGX30CF19C8 vs EP4CGX22CF19C8 Comparación
Comparación detallada lado a lado de EP4CGX30CF19C8 por Intel y EP4CGX22CF19C8 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX30CF19C8 | EP4CGX22CF19C8 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $52,40 | $26,75 |
| Series | Cyclone IV GX | — |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 29,440 | — |
| Embedded Memory | 1,105,920 bits | — |
| Memory Blocks (M9K) | [DATA_NEEDED: M9K block count] | — |
| Embedded Multipliers (18x18) | 66 | — |
| User I/O Pins | 150 | — |
| Transceivers | Up to 8 channels @ 3.125 Gbps | — |
| PLLs | 4 (general-purpose) | — |
| Process Technology | 60 nm | 60 nm low-power |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (LVCMOS/LVDS) | — |
| Speed Grade | 8 (commercial) | C8 (commercial) |
| Temperatura de funcionamiento | -40C to +100C (TJ) | — |
| Encapsulado | 324-FBGA (FineLine BGA), 19 mm body | 324-ball FBGA, 1.0 mm pitch |
| Tipo de montaje | Surface Mount | — |
| Estado RoHS | Compliant | Compliant |
| Programming Tool | Intel Quartus Prime (legacy: Quartus II) | — |
| Configuration Mode | AS / PS / JTAG | — |
| Logic Elements | — | 21,280 |
| Embedded Memory (bits) | — | 774,144 |
| Number of M9K Memory Blocks | — | 66 |
| Embedded 18x18 Multipliers | — | 80 |
| General-Purpose PLLs | — | 2 |
| Maximum User I/O Pins | — | 150 |
| Transceiver Channels | — | Up to 4 full-duplex (varies by package) |
| Maximum Transceiver Data Rate | — | 3.125 Gbps |
| Core Supply Voltage | — | 1.2 V |
| Operating Temperature (junction) | — | 0°C to 85°C (commercial) |
| Configuration Modes | — | JTAG, AS, PS, FPP |