EP4CGX50CF23C7N vs EP4CGX75CF23C7N Comparación
Comparación detallada lado a lado de EP4CGX50CF23C7N por Intel y EP4CGX75CF23C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX50CF23C7N | EP4CGX75CF23C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $110,50 | $71,20 |
| Family | Cyclone IV GX | — |
| Logic Elements (LE) | 49,888 | — |
| Embedded Memory (Bits) | 2,562,048 (2.5 Mb) | — |
| User I/O | 290 | — |
| Logic Array Blocks | 47 | — |
| Multi-Gigabit Transceivers | 4 channels up to 3.125 Gbps | — |
| Hard Memory Controllers | Yes (DDR/DDR2/QDRII/QDRII+/RLDRAM II) | 2 |
| Core Voltage | 1.2 V | — |
| I/O Voltage Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL (1.2V-3.3V) | — |
| Encapsulado | 484-FBGA (F23, 23 x 23 mm) | 484-ball BGA (F23, 23 x 23 mm) |
| Speed Grade | C7 (commercial) | — |
| Temperatura de funcionamiento | -40C to +85C (commercial) | 0 °C to 85 °C (commercial) |
| Process Technology | 60 nm TSMC low-power | 60 nm low-power CMOS |
| Configuration Modes | JTAG, Active Serial (EPCS), Passive Serial, Fast Passive Parallel | AS, PS, FPP, JTAG |
| Estado RoHS | Compliant (lead-free) | Compliant |
| Tipo de montaje | Surface Mount | Surface Mount |
| Series | — | Cyclone IV GX |
| Logic Elements | — | 73,920 |
| Embedded Memory (bits) | — | 4,257,792 |
| Maximum User I/O Pins | — | 290 |
| Number of Logic Array Blocks (LABs) | — | 4,500 |
| Total Transceiver Channels | — | 8 (up to 3.125 Gbps) |
| Number of PLLs | — | 4 |
| Core Supply Voltage | — | 1.16 V to 1.24 V (nominal 1.2 V) |