EP4CGX50DF27C7N vs EP4CGX50DF27I6N Comparación
Comparación detallada lado a lado de EP4CGX50DF27C7N por Intel y EP4CGX50DF27I6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP4CGX50DF27I6N - Cyclone IV GX FPGA, 49.9K LEs, 672-FBGA | Intel (Altera)
EP4CGX50DF27I6N ✓ ActivoComparación de especificaciones
| Parámetro | EP4CGX50DF27C7N | EP4CGX50DF27I6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $58,60 | $52,75 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 49,888 | — |
| Logic Array Blocks (LAB) | [DATA_NEEDED: LAB count for EP4CGX50] | — |
| Total Embedded Memory Bits | 2,562,048 | — |
| User I/O Pins (max) | 310 | — |
| Transceivers | Yes (3.125 Gbps GX channels, package-dependent) | — |
| Core Supply Voltage | 1.2 V | — |
| Process Node | 60 nm | — |
| Operating Temperature (Commercial 'C') | 0C to +85C | — |
| Encapsulado | 672-pin FBGA (FineLine BGA) | 672-ball FBGA (F27) |
| Tipo de montaje | Surface Mount | Surface Mount |
| PLL Count | 6 | — |
| Hard Memory Controller | DDR/DDR2/DDR3/QDRII/RLDRAM PHY | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements | — | 49,888 |
| Process Technology | — | 60 nm low-power |
| Core Voltage | — | 1.2 V |
| Embedded Memory | — | 2,502 Kbits |
| Embedded Multipliers (18x18) | — | 113 |
| Maximum User I/O | — | 310 |
| Transceiver Channels | — | 8 |
| Transceiver Data Rate | — | up to 3.125 Gbps |
| General-purpose PLLs | — | 4 |
| Operating Temperature (Industrial grade) | — | -40C to +100C junction |
| Configuration Modes | — | AS, PS, FPP, JTAG |