EP4CGX50DF27C8N vs EP4CGX50DF27I8N Comparación
Comparación detallada lado a lado de EP4CGX50DF27C8N por Intel y EP4CGX50DF27I8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX50DF27C8N | EP4CGX50DF27I8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $49,10 | $58,90 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Cyclone IV GX | — |
| Family | Cyclone IV GX | Cyclone IV GX |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 49,888 | — |
| Embedded Memory | 2,562,048 bits (M9K blocks) | — |
| Maximum User I/O | 310 | — |
| Package Type | FBGA-672 (672-ball Fine-pitch BGA) | — |
| Pin/Package Pitch | [DATA_NEEDED: BGA ball pitch] | — |
| Core Voltage | 1.2 V | — |
| Supply Voltage (datasheet range) | 1.2 V core | — |
| Speed Grade | 8 (faster performance bin) | 8 (fastest) |
| Temperature Grade | C (commercial, 0 C to +85 C) | Industrial (-40 C to +100 C) |
| Transceivers | Up to 8 channels, up to 3.125 Gbps | — |
| Embedded Multipliers | 18x18 multipliers | — |
| PLLs | 4 | 4 |
| Global Clocks | [DATA_NEEDED: global clock count] | — |
| Temperatura de funcionamiento | 0 C to +85 C (commercial) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements (LEs) | — | 49,888 |
| Embedded Memory (bits) | — | 2,562,048 |
| Embedded Memory Blocks | — | 250 x M9K |
| 18 x 18 Multipliers | — | 200 |
| Global Clock Networks | — | 20 |
| Maximum User I/O Pins | — | 310 |
| Transceiver Channels | — | 8 (up to 3.125 Gbps) |
| PCI Express Hard IP | — | Gen1 x1/x2/x4 |
| Process Technology | — | 60 nm |
| Core Supply Voltage | — | 1.2 V |
| I/O Bank Voltages | — | 1.0 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Encapsulado | — | 672-ball FineLine BGA (F27) |