EP4CGX75CF23C8 vs EP4CGX75CF23I7 Comparación
Comparación detallada lado a lado de EP4CGX75CF23C8 por Intel y EP4CGX75CF23I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX75CF23C8 | EP4CGX75CF23I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $88,20 | $135,00 |
| Family | Cyclone IV GX | — |
| Logic Elements (LE) | 73,920 | — |
| Configurable Logic Blocks (CLBs) | 4,620 | — |
| Embedded Memory | 4,257,792 bits (~4.05 Mbit) | — |
| Maximum User I/O | 290 | — |
| Transceivers | 8 channels, up to 3.125 Gbps | — |
| PCIe Hard IP Blocks | 2 (Gen1) | — |
| Encapsulado | 484-ball FBGA (F23) | — |
| Package Body Size | 23 x 23 mm | — |
| Ball Pitch | 1.0 mm | — |
| Process Technology | 60 nm low-power | 60 nm |
| Core Voltage | 1.2 V (typical) | 1.2 V |
| Speed Grade | 8 (commercial) | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | -40C to +100C (Industrial I7 grade) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Series | — | Cyclone IV GX |
| Logic Elements | — | 73,920 |
| Total Memory Bits | — | 4,257,792 |
| Number of LABs/CLBs | — | 4,620 |
| Number of Logic Elements/Cells | — | 73,920 |
| Total RAM Bits | — | 4,257,792 |
| Number of I/O | — | 290 |
| Number of Multipliers (18x18) | — | 290 |
| Voltage Supply | — | 1.0 V / 1.2 V / 2.5 V / 3.3 V |
| Encapsulado / Carcasa | — | 484-FBGA (FBGA-484, 23x23 mm, 1.0 mm pitch) |
| Transceiver Speed | — | 3.125 Gbps |
| Lead-Free | — | Yes |
| Nivel MSL | — | [DATA_NEEDED: MSL Level] |