EP4CGX75CF23I7 vs EP4CGX75CF23C7 Comparación
Comparación detallada lado a lado de EP4CGX75CF23I7 por Intel y EP4CGX75CF23C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP4CGX75CF23C7 - Cyclone IV GX FPGA 73.9k LE, 290 I/O, 484-BGA | Intel
EP4CGX75CF23C7 ✓ ActivoComparación de especificaciones
| Parámetro | EP4CGX75CF23I7 | EP4CGX75CF23C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $135,00 | $60,50 |
| Series | Cyclone IV GX | — |
| Logic Elements | 73,920 | — |
| Total Memory Bits | 4,257,792 | 4,257,792 bits |
| Number of LABs/CLBs | 4,620 | 4620 |
| Number of Logic Elements/Cells | 73,920 | — |
| Total RAM Bits | 4,257,792 | — |
| Number of I/O | 290 | 290 |
| Number of Multipliers (18x18) | 290 | — |
| Voltage Supply | 1.0 V / 1.2 V / 2.5 V / 3.3 V | — |
| Core Voltage | 1.2 V | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial I7 grade) | 0C to +85C (commercial, C7 suffix) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Encapsulado / Carcasa | 484-FBGA (FBGA-484, 23x23 mm, 1.0 mm pitch) | — |
| Process Technology | 60 nm | — |
| Transceiver Speed | 3.125 Gbps | — |
| Estado RoHS | Compliant | Non-Compliant (Contains Lead per DigChip listing) |
| Lead-Free | Yes | — |
| Nivel MSL | [DATA_NEEDED: MSL Level] | — |
| Family | — | Cyclone IV GX |
| Logic Elements (LE) | — | 73,920 |
| Number of Logic Gates | — | [DATA_NEEDED: gates] |
| Embedded Memory | — | M9K blocks |
| Encapsulado | — | 484-BGA (FBGA) |
| Package Code | — | F23 |
| Ball Pitch | — | 1.0 mm |
| Supply Voltage (Core) | — | 1.0V / 1.2V |
| Transceivers | — | 3.125 Gbps integrated |
| Lead Free Status | — | Contains Lead (per DigChip listing) |