EP4CGX75CF23I7N vs EP4CGX110CF23I7N Comparación
Comparación detallada lado a lado de EP4CGX75CF23I7N por Intel y EP4CGX110CF23I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX75CF23I7N | EP4CGX110CF23I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $165,30 | $1.650,08 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Series | EP4CGX75 (F23) | — |
| Logic Elements (LE) | 73,920 | — |
| Configurable Logic Blocks (CLBs) | 4,620 | — |
| Embedded Memory | 4,257,792 bits (316 M9K blocks) | 5,621,760 bits |
| Embedded Multipliers (18x18) | 150 | — |
| User I/O Pins | 290 | — |
| Transceivers | 8 channels up to 3.125 Gbps | — |
| PLLs | 8 | — |
| Encapsulado | 484-FBGA (F23), 23 x 23 mm, 1.0 mm pitch | FBGA-484 (484-pin FineLine BGA) |
| Temperatura de funcionamiento | -40C to +100C (industrial I7 grade) | -40 °C to +100 °C (industrial, inferred from 'I') |
| Tipo de montaje | Surface Mount (FBGA) | Surface Mount (BGA) |
| Process Node | 60 nm low-power | — |
| Configuration Modes | Active Serial, Passive Serial, JTAG, Fast Passive Parallel | — |
| Estado RoHS | Lead-free (compliant per datasheet.com excerpt) | — |
| Nivel MSL | 3 (per typical Altera FBGA) | — |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Logic Elements | — | 109,424 |
| Configurable Logic Blocks (CLBs / LABs) | — | 6,839 |
| User I/O Count | — | 270 |
| Supply Voltage (Core) | — | 1.2 V |
| Process Technology | — | 60 nm |
| Package Body Size | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Maximum Operating Frequency | — | 472.5 MHz |
| Speed Grade | — | I7 (industrial, balance of speed and power) |
| Lead-Free / RoHS | — | Yes (N suffix) |