EP4SGX360FF35I3 vs EP4SGX360FF35I3N Comparación
Comparación detallada lado a lado de EP4SGX360FF35I3 por Intel y EP4SGX360FF35I3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX360FF35I3 | EP4SGX360FF35I3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.695,00 | $9.100,00 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements (LE) | 353,600 | 353,600 |
| LABs/CLBs | 14,144 | — |
| Total RAM Bits | 23,105,536 | — |
| Embedded Memory | [DATA_NEEDED: total Kbits] | — |
| User I/O Count | 564 | 564 |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Transceiver Data Rate (max) | [DATA_NEEDED: Gbps] | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm | — |
| Temperatura de funcionamiento | -40C to +100C | -40 °C to +100 °C (Industrial) |
| Encapsulado | 1152-BBGA, FCBGA (Flip-Chip) | 1152-BBGA, FCBGA (35 mm body, 1 mm pitch) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Speed Grade | I3 | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Nivel MSL | [DATA_NEEDED: MSL] | — |
| Adaptive Logic Modules (ALM) | — | 141,440 |
| Embedded Memory (Bits) | — | 23,105,536 |
| Total RAM Blocks | — | 564 (M20K blocks) |
| Number of LABs/CLBs | — | 14144 |
| Supply Voltage Core | — | 0.95 V (typical) |
| Transceiver Data Rate | — | Up to 8.5 Gbps |
| Process Node | — | 40 nm |