EP4SGX360FF35I3N vs EP4SGX360FF35C2XN Comparación
Comparación detallada lado a lado de EP4SGX360FF35I3N por Intel y EP4SGX360FF35C2XN por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX360FF35I3N | EP4SGX360FF35C2XN |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9.100,00 | $2.600,00 |
| Series | Stratix IV GX | — |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALM) | 141,440 | — |
| Embedded Memory (Bits) | 23,105,536 | — |
| Total RAM Blocks | 564 (M20K blocks) | — |
| User I/O Count | 564 | — |
| Number of LABs/CLBs | 14144 | — |
| Encapsulado | 1152-BBGA, FCBGA (35 mm body, 1 mm pitch) | 1152-BBGA, FCBGA (Flip-Chip BGA) |
| Temperatura de funcionamiento | -40 °C to +100 °C (Industrial) | 0C to +85C (Commercial) |
| Supply Voltage Core | 0.95 V (typical) | — |
| Transceiver Data Rate | Up to 8.5 Gbps | — |
| Process Node | 40 nm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Logic Elements | — | 353,600 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| LABs/CLBs | — | 14,144 |
| Embedded Memory (bits) | — | 23,105,536 |
| Number of Logic Elements/Cells | — | 353,600 |
| Total RAM Bits | — | 23,105,536 |
| Number of I/O | — | 564 |
| User I/O Banks | — | 12 |
| Supply Voltage - Core | — | 0.9 V |
| Speed Grade | — | -2 |
| Number of Transceivers | — | 24 |
| Transceiver Data Rate (max) | — | 8.5 Gbps |
| DSP Multipliers (18x18) | — | 1,920 (estimated per family datasheet) |
| Process Technology | — | 40 nm TSMC |
| Lead-Free | — | Yes |