EP4SGX360NF45C2N vs EP4SGX360NF45C3N Comparación
Comparación detallada lado a lado de EP4SGX360NF45C2N por Intel y EP4SGX360NF45C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX360NF45C2N | EP4SGX360NF45C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $11.800,00 | $3.300,00 |
| Family | Stratix IV GX | Stratix IV GX FPGA |
| Logic Elements | 353,600 | — |
| Logic Array Blocks (LABs) | 14,144 | — |
| User I/Os | 920 | — |
| Embedded Memory Bits | 23,105,536 | — |
| Embedded Memory Type | M9K + MLAB | — |
| Process Technology | 40 nm | 40 nm CMOS |
| Core Voltage (VCCINT) | 0.9 V | — |
| Transceivers | Hard multi-gigabit transceivers up to 8.5 Gbps | Multi-gigabit transceivers up to 8.5 Gbps |
| PCI Express Hard IP | Gen1/Gen2 with x1/x2/x4 support | — |
| Speed Grade | -2 (commercial performance) | C3 (commercial) |
| Temperatura de funcionamiento | 0C to 85C (commercial, N suffix in legacy Altera marking) | 0C to +85C |
| Encapsulado | 1932-ball FC-FBGA | — |
| Tipo de montaje | Surface Mount (flip-chip BGA) | Surface Mount |
| Nivel MSL | MSL3 (per JEDEC J-STD-020) | — |
| Lead-Free / RoHS | Yes (compliant) | — |
| Configuration | JTAG / Fast Passive Parallel / Active Serial (EPCS) | — |
| Series | — | Stratix IV GX |
| Logic Elements / Cells | — | 353600 |
| Number of LABs / CLBs | — | 14144 |
| Number of Logic Elements / Cells | — | 353600 |
| Total RAM Bits | — | 23105536 |
| Number of I/O | — | 920 |
| Core Voltage | — | 0.9 V |
| Encapsulado / Carcasa | — | 1932-BBGA, FCBGA |
| Package Type | — | FC-FBGA-1932 |
| Estado RoHS | — | Compliant (Lead-free) |