EP4SGX530HH35C2N vs EP4SGX530HH35I3N Comparación
Comparación detallada lado a lado de EP4SGX530HH35C2N por Intel y EP4SGX530HH35I3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX530HH35C2N | EP4SGX530HH35I3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.500,00 | $3.200,00 |
| Device Type | FPGA - Field Programmable Gate Array | FPGA - Field Programmable Gate Array |
| Series | Stratix IV GX | — |
| Logic Elements (LE) | 531,200 | — |
| Adaptive Logic Modules (ALMs) | 21,248 | 21,248 |
| Embedded Memory | 28,033,024 bits | — |
| Logic Cells / LABs | 21,248 LABs | — |
| User I/O Pins | 564 | — |
| Encapsulado | 1152-BBGA, FCBGA (FC-HFBGA) | 1152-ball FCBGA (HBGA), 42.5 x 42.5 mm, 1.0 mm pitch |
| Package Size | 42.50 mm x 42.50 mm | — |
| Tensión de alimentación | 0.9 V (core) | — |
| Internal Frequency | 800 MHz (max) | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | -40C to +85C (industrial) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Nivel MSL | 3 | 3 |
| Estado RoHS | Compliant | Compliant |
| Transceiver Data Rate | up to 8.5 Gbps | — |
| PCIe Hard IP | Gen1 / Gen2 | — |
| Family | — | Stratix IV GX |
| Logic Elements | — | 531,200 |
| Embedded Memory (bits) | — | 28,033,024 |
| Logic Blocks / LABs | — | 21,248 |
| Maximum User I/Os | — | 564 |
| DSP Blocks | — | 1,024 (18x18 multipliers) |
| Transceivers | — | 24 channels |
| Transceiver Data Rate (max) | — | 8.5 Gbps |
| PLLs | — | 8 (fractional support) |
| Internal Frequency (max) | — | 800 MHz |
| Lead-Free | — | Yes |
| Process Node | — | 40 nm |