EP4SGX530HH35I3N vs EP4SGX530HH35I4 Comparación
Comparación detallada lado a lado de EP4SGX530HH35I3N por Intel y EP4SGX530HH35I4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX530HH35I3N | EP4SGX530HH35I4 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.200,00 | $2.150,00 |
| Family | Stratix IV GX | — |
| Device Type | FPGA - Field Programmable Gate Array | FPGA - Field Programmable Gate Array |
| Logic Elements | 531,200 | 531,200 |
| Adaptive Logic Modules (ALMs) | 21,248 | — |
| Embedded Memory (bits) | 28,033,024 | 28,033,024 |
| Logic Blocks / LABs | 21,248 | — |
| Maximum User I/Os | 564 | — |
| DSP Blocks | 1,024 (18x18 multipliers) | — |
| Transceivers | 24 channels | — |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| PLLs | 8 (fractional support) | — |
| Temperatura de funcionamiento | -40C to +85C (industrial) | 0C to 85C (Industrial) |
| Internal Frequency (max) | 800 MHz | — |
| Encapsulado | 1152-ball FCBGA (HBGA), 42.5 x 42.5 mm, 1.0 mm pitch | 1152-BBGA, FCBGA (HBGA-1152), 42.5 x 42.5 mm |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Nivel MSL | 3 | — |
| Process Node | 40 nm | 40 nm TSMC |
| Series | — | Stratix IV GX |
| Logic Array Blocks (LABs) | — | 21,248 |
| Maximum User I/O | — | 564 |
| Number of Transceivers | — | 24 |
| Transceiver Data Rate | — | 600 Mbps to 8.5 Gbps |
| Maximum Internal Frequency | — | 800 MHz |
| Embedded 18x18 Multipliers | — | 1,040 |
| PLL Count | — | 4 |
| Global Clock Networks | — | 16 |
| Ball Pitch | — | 1.0 mm |
| Speed Grade | — | I4 |
| PCI Express Hard IP | — | Gen1/Gen2 x1/x4/x8 |