EP4SGX530KH40C4N vs EP4SGX530KH40I3 Comparación
Comparación detallada lado a lado de EP4SGX530KH40C4N por Intel y EP4SGX530KH40I3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX530KH40C4N | EP4SGX530KH40I3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.680,00 | $12.500,00 |
| Family | Stratix IV GX | — |
| Logic Elements | 531,200 | — |
| Adaptive Logic Modules (ALMs) | 21,248 | [DATA_NEEDED: ALM count] |
| Embedded Memory | 27,480 Kbits | — |
| User I/Os | 744 | — |
| Transceivers | 24 channels | Up to 24 channels |
| Max Transceiver Data Rate | 8.5 Gbps | 8.5 Gbps |
| DSP Blocks (18x18 Multipliers) | 1,288 | — |
| Phase-Locked Loops (PLLs) | 12 | — |
| Process Node | 40 nm | — |
| Core Voltage | 0.9 V | 0.9 V |
| Temperatura de funcionamiento | 0 C to 85 C (Commercial) | — |
| Encapsulado | 1517-ball FCBGA (HBGA), 42.5 x 42.5 mm | 1517-BBGA, FCBGA (FC-HFBGA), 40x40 mm |
| Tipo de montaje | Surface Mount | Surface Mount (Flip-Chip BGA) |
| Lead Free / RoHS | Yes / Compliant | — |
| Series | — | Stratix IV GX |
| Manufacturer | — | Intel (formerly Altera) |
| Process Technology | — | TSMC 40 nm |
| Logic Elements (LEs) | — | 531,200 |
| Total Embedded Memory | — | 28,033,024 bits (28 Mb) |
| Number of LABs/CLBs | — | 21,248 |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Maximum User I/Os | — | 744 |
| Temperature Grade | — | Industrial (I3) |
| Estado RoHS | — | Compliant |