EP4SGX530KH40C4N vs EP4SGX530KH40I4N Comparación
Comparación detallada lado a lado de EP4SGX530KH40C4N por Intel y EP4SGX530KH40I4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX530KH40C4N | EP4SGX530KH40I4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.680,00 | $3.425,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 531,200 | 531,200 |
| Adaptive Logic Modules (ALMs) | 21,248 | 21,248 |
| Embedded Memory | 27,480 Kbits | 28,033,024 bits (approx. 28 Mb) |
| User I/Os | 744 | — |
| Transceivers | 24 channels | — |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| DSP Blocks (18x18 Multipliers) | 1,288 | — |
| Phase-Locked Loops (PLLs) | 12 | — |
| Process Node | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Temperatura de funcionamiento | 0 C to 85 C (Commercial) | -40 °C to +100 °C (industrial) |
| Encapsulado | 1517-ball FCBGA (HBGA), 42.5 x 42.5 mm | 1517-ball FC-HFBGA (Flip-Chip Fine-Pitch BGA) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA, requires microvia PCB) |
| Lead Free / RoHS | Yes / Compliant | — |
| Maximum User I/O Pins | — | 744 |
| DSP Blocks | — | Up to 1,288 (variable by configuration) |
| DSP Multiplier Modes | — | 9x9, 12x12, 18x18, 36x36 full-precision |
| Maximum Transceivers | — | 24 (multi-gigabit, up to 8.5 Gbps) |
| Process Technology | — | TSMC 40 nm |
| Core Voltage (Vcc) | — | 0.9 V |
| Speed Grade | — | I4 (industrial, fast) |
| Configuration Modes | — | FPP, AS, PS, JTAG |
| Design Software | — | Altera Quartus II (Stratix IV device support) |
| Estado RoHS | — | Compliant |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |