EP4SGX530KH40I3 vs EP4SGX530KH40C4N Comparación
Comparación detallada lado a lado de EP4SGX530KH40I3 por Intel y EP4SGX530KH40C4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX530KH40I3 | EP4SGX530KH40C4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $12.500,00 | $3.680,00 |
| Series | Stratix IV GX | — |
| Manufacturer | Intel (formerly Altera) | — |
| Process Technology | TSMC 40 nm | — |
| Logic Elements (LEs) | 531,200 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | 21,248 |
| Total Embedded Memory | 28,033,024 bits (28 Mb) | — |
| Number of LABs/CLBs | 21,248 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Maximum User I/Os | 744 | — |
| Transceivers | Up to 24 channels | 24 channels |
| Max Transceiver Data Rate | 8.5 Gbps | 8.5 Gbps |
| Core Voltage | 0.9 V | 0.9 V |
| Temperature Grade | Industrial (I3) | — |
| Encapsulado | 1517-BBGA, FCBGA (FC-HFBGA), 40x40 mm | 1517-ball FCBGA (HBGA), 42.5 x 42.5 mm |
| Tipo de montaje | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Estado RoHS | Compliant | — |
| Family | — | Stratix IV GX |
| Logic Elements | — | 531,200 |
| Embedded Memory | — | 27,480 Kbits |
| User I/Os | — | 744 |
| DSP Blocks (18x18 Multipliers) | — | 1,288 |
| Phase-Locked Loops (PLLs) | — | 12 |
| Process Node | — | 40 nm |
| Temperatura de funcionamiento | — | 0 C to 85 C (Commercial) |
| Lead Free / RoHS | — | Yes / Compliant |