EP4SGX70HF35I3G vs EP4SGX70HF35C3G Comparación
Comparación detallada lado a lado de EP4SGX70HF35I3G por Intel y EP4SGX70HF35C3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX70HF35I3G | EP4SGX70HF35C3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.250,00 | $1.380,00 |
| Series | Stratix IV GX | Stratix IV GX |
| Logic Elements | 72,600 LE | 72,600 |
| Adaptive Logic Modules (ALMs) | 29,040 ALM | — |
| Embedded Memory | 7.20 Mbit (7,564,880 bits) | — |
| User I/Os | 480 | — |
| Transceivers | 9 channels up to 8.5 Gbps (GX) | — |
| 18x18 Multipliers | 488 | — |
| PLLs | 4 per quadrant | — |
| Process Technology | 40 nm TSMC | 40 nm |
| Core Supply Voltage | 950 mV | 0.87 V to 0.93 V |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Speed Grade | I3 | HF35 |
| Encapsulado | 1152-ball FCBGA, 35x35 mm, 1.0 mm pitch | 1152-BBGA, FCBGA (35 mm × 35 mm) |
| Tipo de montaje | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Packaging | Tray | — |
| LABs/CLBs | — | 2,904 |
| Total RAM Bits | — | 7,564,880 |
| User I/O Count | — | 488 |
| Number of Transceivers | — | 8 |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| Operating Temperature (Junction) | — | 0°C to 85°C |
| Temperature Grade | — | Commercial (C3) |
| Configuration Method | — | Passive Serial, Fast Passive Parallel, Active Serial, JTAG |
| Estado RoHS | — | Compliant |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |