EP4SGX70HF35I3G vs EP4SGX70HF35I4G Comparación
Comparación detallada lado a lado de EP4SGX70HF35I3G por Intel y EP4SGX70HF35I4G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX70HF35I3G | EP4SGX70HF35I4G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.250,00 | $1.150,00 |
| Series | Stratix IV GX | EP4SGX70 |
| Logic Elements | 72,600 LE | 72,600 |
| Adaptive Logic Modules (ALMs) | 29,040 ALM | — |
| Embedded Memory | 7.20 Mbit (7,564,880 bits) | — |
| User I/Os | 480 | — |
| Transceivers | 9 channels up to 8.5 Gbps (GX) | — |
| 18x18 Multipliers | 488 | — |
| PLLs | 4 per quadrant | — |
| Process Technology | 40 nm TSMC | — |
| Core Supply Voltage | 950 mV | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | -40C to +100C (Industrial, -I4G grade) |
| Speed Grade | I3 | -4 (I4G grade) |
| Encapsulado | 1152-ball FCBGA, 35x35 mm, 1.0 mm pitch | 1152-BBGA, FCBGA |
| Tipo de montaje | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Packaging | Tray | — |
| Family | — | Stratix IV GX |
| Embedded Memory Bits | — | 7,564,880 |
| Total RAM Bits | — | 7,564,880 |
| Number of I/O | — | 488 |
| Process Node | — | 40 nm |
| Voltage - Supply | — | 0.95 V core, 1.1 V/2.5 V/3.3 V I/O (Stratix IV family typical) |
| Configuration | — | JTAG / Serial |
| Estado RoHS | — | Compliant |
| Lead Free | — | Yes |
| Nivel MSL | — | 3 (per JEDEC J-STD-020) |
| Temperature Grade | — | Industrial |