EPF10K100ARC240-1 vs EPF10K100BQC240-1 Comparación
Comparación detallada lado a lado de EPF10K100ARC240-1 por Altera y EPF10K100BQC240-1 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EPF10K100BQC240-1 - 100K FLEX-10K FPGA, 240-PQFP | Intel / Altera
EPF10K100BQC240-1 ⚠ Última compraComparación de especificaciones
| Parámetro | EPF10K100ARC240-1 | EPF10K100BQC240-1 |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $205,00 | $119,00 |
| Device Family | FLEX 10KA (Altera / Intel) | — |
| Device Type | SRAM-based field programmable gate array (FPGA), CMOS | — |
| Logic Elements (LE) | 4,992 | — |
| Logic Array Blocks (LAB) | 624 | — |
| Embedded RAM | 24,576 bits | — |
| User I/O Pins | 189 | — |
| Speed Grade | -1 (fastest FLEX 10KA bin) | -1 |
| Tensión de alimentación | 3.3 V (CMOS) | — |
| Propagation Delay | 0.6 ns (distributor specification listing) | — |
| Encapsulado / Carcasa | 240-BFQFP Exposed Pad (RQFP / HFQFP) | — |
| Number of Terminals | 240 | — |
| Terminal Form | Gull wing | — |
| Package Shape | Square | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Rango de temperatura de funcionamiento | 0 C to +70 C (commercial) | — |
| Temperature Grading | Commercial | — |
| Nivel de sensibilidad a la humedad (MSL) | [DATA_NEEDED: MSL level] | — |
| RoHS / Lead-Free Status | [DATA_NEEDED: RoHS status] | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| Configuration Device Required | Yes (external, e.g. EPC1PC8 / EPC2LC20N) | — |
| Series | — | FLEX-10K |
| Family | — | FLEX-10K (EPF10K100B) |
| Logic Elements (LEs) | — | 6,144 |
| Typical Gates | — | 100,000 |
| Embedded Array Blocks (EABs) | — | 12 |
| Total RAM Bits | — | 24,576 (12 × 2,048 bits per EAB) |
| Maximum User I/O | — | 189 |
| Supply Voltage (VCCINT / VCCIO) | — | 4.75 V to 5.25 V |
| Combinatorial tPD (typical) | — | 11 ns |
| Encapsulado | — | 240-pin BFQFP / PQFP (BQC suffix) |
| Package Dimensions | — | 32 mm × 32 mm |
| Process Technology | — | 0.42 µm SRAM CMOS |
| Temperatura de funcionamiento | — | 0 °C to +70 °C (commercial) |
| Configuration Method | — | ByteBlasterMV / BitBlaster / JTAG |
| Estado RoHS | — | [DATA_NEEDED: RoHS compliance] |
| Nivel MSL | — | 3 (per JEDEC J-STD-020) |