EPF10K100EFC256-2X vs EPF10K100BFC256-2 Comparación
Comparación detallada lado a lado de EPF10K100EFC256-2X por Altera y EPF10K100BFC256-2 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Altera
EPF10K100EFC256-2X - FLEX 10KE FPGA, 49,152 Gates, 256-BGA | Altera
EPF10K100EFC256-2X ObsoleteAltera
EPF10K100BFC256-2 - FLEX 10K FPGA 100K Gates 256-BGA | Altera
EPF10K100BFC256-2 ⚠ Última compraComparación de especificaciones
| Parámetro | EPF10K100EFC256-2X | EPF10K100BFC256-2 |
|---|---|---|
| Marca | Altera | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $30,50 | $65,00 |
| Series | FLEX-10KE | FLEX 10K |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements / Cells | 49,152 | — |
| Number of LABs/CLBs | 624 | — |
| Number of Logic Elements/Cells | 4,992 | — |
| Total RAM Bits | 49,152 | 6,144 |
| Number of I/O | 191 | — |
| Number of Gates | 100,000 | — |
| Voltage - Supply | 2.375V to 2.625V (core), 3.0V to 3.6V (I/O) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | 0°C to 70°C | 0 C to +70 C (Commercial) |
| Encapsulado / Carcasa | 256-FBGA (FineLine BGA, 17x17 mm) | — |
| Supplier Device Package | 256-BGA | — |
| Speed Grade | -2 | -2 |
| Logic Family | CMOS (SRAM-based) | — |
| Propagation Delay | 0.6 ns (per EAB) | — |
| Configuration Interface | JTAG / Passive Serial / Active Serial | — |
| Lead-Free / RoHS Status | Depends on date code - verify with distributor | — |
| Nivel MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Manufacturer | — | Altera (Intel) |
| Device Logic | — | 100,000 typical gates |
| Logic Elements (LEs) | — | 4,992 |
| Embedded Array Blocks (EABs) | — | 3 (2,048 bits each) |
| Maximum Operating Frequency | — | 250 MHz |
| Pin-to-Pin Delay | — | 12 ns |
| Process Technology | — | 0.22 um CMOS SRAM |
| Tensión de alimentación | — | 4.75 V to 5.25 V |
| Encapsulado | — | 256-FBGA (17 x 17 mm) |
| Configuration Method | — | SRAM (external EPROM/flash) |
| JTAG Support | — | Yes (IEEE 1149.1 boundary scan) |
| Estado RoHS | — | [DATA_NEEDED: rohs status] |