EPF10K100EFC484-3 vs EPF10K130EFC484-3 Comparación
Comparación detallada lado a lado de EPF10K100EFC484-3 por Altera y EPF10K130EFC484-3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K100EFC484-3 | EPF10K130EFC484-3 |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $65,00 | $178,92 |
| Family | FLEX 10KE | FLEX 10KE |
| Typical Gates | 100,000 | — |
| Maximum System Gates | 158,000 | — |
| Logic Elements | 4,992 | — |
| Logic Array Blocks (LABs) | 624 | 832 |
| Embedded Memory (EAB RAM) | 49,152 bits | — |
| User I/O Pins | 338 | — |
| Speed Grade | -3 (fastest commercial) | -3 |
| Encapsulado | 484-ball FineLine BGA | 484-pin FBGA (FineLine BGA) |
| Temperatura de funcionamiento | 0C to +70C (Commercial) | 0 C to +70 C (commercial) |
| Core Voltage | 2.5 V | — |
| I/O Standards Supported | 2.5V / 3.3V / 5.0V (PCI-compliant) | — |
| JTAG Support | IEEE Std. 1149.1-1990 BST | — |
| Configuration Method | SRAM (volatile, requires configuration device) | SRAM-based, serial or parallel, requires external configuration device |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Elements (LEs) | — | 6,656 |
| Typical Gate Count | — | 130,000 system gates |
| Embedded Memory (EABs) | — | 16 x 4,096 bits (65,536 bits total) |
| Maximum User I/O | — | 369 |
| Supply Voltage (Core) | — | 3.3 V |
| I/O Voltage Support | — | 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) |
| Propagation Delay | — | 0.6 ns (per LE) |
| Tipo de montaje | — | Surface Mount (BGA) |
| Logic Family | — | CMOS (SRAM-based) |