EPF10K100EFC484-3N vs EPF10K200SFC484-3N Comparación
Comparación detallada lado a lado de EPF10K100EFC484-3N por Intel y EPF10K200SFC484-3N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K100EFC484-3N | EPF10K200SFC484-3N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $142,00 | $261,00 |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements / Cells | 4992 | — |
| Total Gates | 100,000 | — |
| Embedded Memory (EAB) | 49,152 bits (12 EABs) | — |
| Logic Array Blocks (LABs) | 624 | — |
| User I/Os | 338 | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS SRAM |
| Core Voltage (VCCINT) | 2.5 V | 5.0 V |
| I/O Voltage (VCCIO) | MultiVolt (2.5 V / 3.3 V / 5.0 V tolerant per bank) | — |
| Internal Performance | 200 MHz | — |
| Speed Grade | -3 (fastest commercial bin) | -3 (fastest) |
| Encapsulado | 484-ball FineLine BGA (FC484 / FBGA-484) | 484-ball FineLine BGA |
| Temperature Grade | Commercial (0 °C to +70 °C) | — |
| Configuration Method | SRAM (external EPROM/Flash/JTAG required at power-up) | — |
| Lead-Free / RoHS | Yes (N suffix = lead-free) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Series | — | FLEX-10KS |
| Typical Gates | — | 200,000 |
| Logic Elements (LEs) | — | 9,984 |
| LABs | — | 1,248 |
| Embedded Array Blocks (EABs) | — | 4 (up to 24 Kbit RAM) |
| User I/O Pins | — | 369 |
| I/O Voltage Support | — | 2.5 V / 3.3 V / 5.0 V |
| JTAG Support | — | IEEE 1149.1 BST |
| PCI Compliance | — | 3.3 V/33 MHz and 66 MHz (speed grade -3) |
| Temperatura de funcionamiento | — | 0°C to +70°C (commercial, N suffix) |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |