EPF10K130EBC356-1X vs EPF10K100EBC356-3 Comparación
Comparación detallada lado a lado de EPF10K130EBC356-1X por Intel y EPF10K100EBC356-3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EPF10K130EBC356-1X - FLEX 10KE FPGA 130K Gates BGA-356 | Intel / Altera
EPF10K130EBC356-1X ObsoleteComparación de especificaciones
| Parámetro | EPF10K130EBC356-1X | EPF10K100EBC356-3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $132,00 | $62,50 |
| Series | FLEX 10KE | — |
| Family | FLEX 10KE (embedded programmable logic) | FLEX-10KE |
| Logic Cells | 6,656 | — |
| Logic Array Blocks (LABs) | 832 | 624 |
| System Gates | 130,000 | — |
| Embedded Array Blocks (EABs) | Yes (RAM/ROM/FIFO) | — |
| User I/Os | 274 | 274 |
| Propagation Delay | 0.6 ns | — |
| Max Internal Frequency | 333.33 MHz | — |
| Process Technology | 0.22 um CMOS | 0.22 micron CMOS |
| Core Supply Voltage | 2.5 V (2.375 V - 2.625 V) | — |
| Temperatura de funcionamiento | 0 C to 70 C (commercial) | 0 C to 70 C (Commercial) |
| Encapsulado | 356-LBGA (35x35 mm) | 356-LBGA (35 x 35 mm) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Configuration Memory | SRAM (external config EPROM required) | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Logic Elements / Cells | — | 4,992 |
| Total Gates | — | ~100,000 |
| Embedded Memory (RAM bits) | — | 49,152 |
| Supply Voltage (Core) | — | 2.5 V (2.375 V to 2.625 V) |
| Speed Grade | — | -3 |
| Propagation Delay (typical) | — | 0.6 ns |
| Maximum Internal Frequency | — | 200 MHz |
| Configuration Technology | — | SRAM (volatile) |