EPF10K130EFC484-2N vs EPF10K130EFC484-3 Comparación
Comparación detallada lado a lado de EPF10K130EFC484-2N por Altera y EPF10K130EFC484-3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K130EFC484-2N | EPF10K130EFC484-3 |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $799,00 | $178,92 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Series | FLEX-10KE | — |
| Gate Count | 130,000 gates | — |
| Logic Cells | 6,656 cells | — |
| Logic Family | CMOS | CMOS (SRAM-based) |
| Process Technology | 0.22 µm | — |
| Listed Maximum Frequency | 333.33 MHz | — |
| Propagation Delay | 0.6000 ns | 0.6 ns (per LE) |
| User I/Os | 369 I/Os | — |
| Alternative I/O Count Listing | 274 I/Os | — |
| Embedded Memory | 65,536 bits | — |
| Logic Array Blocks | 832 LABs | — |
| Tensión de alimentación | 2.5 V nominal | — |
| Verified Supply-Voltage Range | 2.375 V to 2.625 V | — |
| Alternate Supply Listing | 3.3 V | — |
| Temperatura de funcionamiento | 0 °C to 70 °C | 0 C to +70 C (commercial) |
| Encapsulado | 484-ball FBGA, 23 mm × 23 mm | 484-pin FBGA (FineLine BGA) |
| Package Pin Count | 356 pins | — |
| Ball Pitch | 1 mm | — |
| RoHS Compliance | unknown | — |
| REACH Compliance | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Lead-Free Status | unknown | — |
| Halogen-Free Status | unknown | — |
| Family | — | FLEX 10KE |
| Logic Elements (LEs) | — | 6,656 |
| Typical Gate Count | — | 130,000 system gates |
| Logic Array Blocks (LABs) | — | 832 |
| Embedded Memory (EABs) | — | 16 x 4,096 bits (65,536 bits total) |
| Maximum User I/O | — | 369 |
| Supply Voltage (Core) | — | 3.3 V |
| I/O Voltage Support | — | 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) |
| Speed Grade | — | -3 |
| Tipo de montaje | — | Surface Mount (BGA) |
| Configuration Method | — | SRAM-based, serial or parallel, requires external configuration device |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |