EPF10K200EFC672-3 vs EPF10K200SFC672-1X Comparación
Comparación detallada lado a lado de EPF10K200EFC672-3 por Intel y EPF10K200SFC672-1X por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3 Obsolete
Comparación de especificaciones
| Parámetro | EPF10K200EFC672-3 | EPF10K200SFC672-1X |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $115,00 | $135,00 |
| Series | FLEX 10KE | FLEX-10KS |
| Number of Logic Elements / Cells | 9,984 | — |
| Number of LABs / CLBs | 1248 | — |
| Total RAM Bits | 98,304 bits (12 EABs of 8 Kbits) | — |
| Number of I/O | 470 | — |
| Number of Gates (typical) | 200,000 | — |
| Supply Voltage - Operating | 2.3 V to 2.7 V (2.5 V nominal) | — |
| Process Technology | 0.22 µm CMOS | — |
| Maximum Operating Frequency | 166.67 MHz | — |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Encapsulado / Carcasa | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | 0 °C to +70 °C (commercial) | 0 °C to 70 °C (Commercial) |
| Configuration Memory | SRAM-based (volatile, requires external configuration device) | — |
| Number of PLLs | 4 | — |
| Estado RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS compliance status] |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Family | — | FLEX 10K (legacy) |
| Architecture | — | Reconfigurable CMOS SRAM |
| Typical System Gates | — | 200,000 |
| Maximum System Gates | — | [DATA_NEEDED: maximum system gate count] |
| Logic Elements (LEs) | — | 9,984 |
| Logic Array Blocks (LABs) | — | 1,248 |
| Embedded Array Blocks (EABs) | — | 24 |
| Embedded RAM Bits | — | 98,304 |
| User I/O Pins | — | 470 |
| Core Supply Voltage | — | 2.375 V to 2.625 V (2.5 V nominal) |
| JTAG Support | — | IEEE Std. 1149.1 (adds up to 31,250 gates) |
| Encapsulado | — | 672-ball FineLine BGA, 27 × 27 mm, 1.0 mm pitch |
| Logic Family | — | CMOS |
| Configuration Method | — | SRAM (volatile, reconfigurable at every power-up) |
| Design Tool | — | Quartus (legacy FLEX 10K support) |