EPF10K200EGC599-1 vs EPF10K200EFC672-1 Comparación
Comparación detallada lado a lado de EPF10K200EGC599-1 por Intel y EPF10K200EFC672-1 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera
EPF10K200EGC599-1 ⚠ Última compra
Comparación de especificaciones
| Parámetro | EPF10K200EGC599-1 | EPF10K200EFC672-1 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $880,00 | $198,00 |
| Family | FLEX 10KE | FLEX-10KE |
| Logic Elements (LEs) | 9,984 | — |
| Typical Gates | 200,000 | 200,000 |
| Embedded Array Blocks (EABs) | 470 | — |
| Total RAM Bits | 98,304 | — |
| Core Supply Voltage | 2.375 V to 2.625 V | — |
| I/O Voltage Tolerance | 5.0 V tolerant | — |
| Recuento de pines | 599 | — |
| Package Type | 599-BCPGA (Ceramic Pin Grid Array) | — |
| Package Dimensions | 62.48 x 62.48 mm | — |
| Tipo de montaje | Through-Hole (Socket or Solder) | Surface Mount |
| Temperatura de funcionamiento | 0C to +70C (Commercial) | 0 C to 70 C (Commercial) |
| Programming Interface | JTAG (IEEE 1149.1) | — |
| PLLs | 4 | — |
| Estado RoHS | [DATA_NEEDED: RoHS status of ceramic CPGA variant] | Compliant |
| Logic Elements | — | 9,984 |
| User I/Os | — | 470 |
| Embedded Memory (bits) | — | 98,304 |
| Logic Array Blocks (LABs) | — | 1,248 |
| Encapsulado | — | 672-FBGA (FineLine BGA), 27x27 mm, 1.27 mm pitch |
| Process Technology | — | CMOS, SRAM-based |
| Propagation Delay | — | 0.4 ns |
| Speed Grade | — | -1 |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, True-LVDS |
| Core Voltage | — | 2.5 V (typical, FLEX-10KE) |
| Supply Voltage - Max | — | 3.3 V (I/O) |
| Nivel MSL | — | 3 (168 hours) |