EPF10K200SBC356-1X vs EPF10K200SBC356-2 Comparación
Comparación detallada lado a lado de EPF10K200SBC356-1X por Intel y EPF10K200SBC356-2 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EPF10K200SBC356-1X - 200K Flex 10KE FPGA, 274 I/O, 356-BGA | Intel
EPF10K200SBC356-1X ⚠ Última compraComparación de especificaciones
| Parámetro | EPF10K200SBC356-1X | EPF10K200SBC356-2 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $138,00 | $178,00 |
| Family | FLEX 10KE | FLEX 10KS (Embedded Programmable Logic) |
| Series | FLEX-10KS | FLEX 10KS |
| Typical System Gates | 200,000 | — |
| Maximum System Gates | 513,000 | — |
| Logic Elements (LEs) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 1248 |
| Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | 39,616 | — |
| User I/Os | 274 | 274 |
| Process Technology | 0.22 µm CMOS | 0.22 um CMOS |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V / 5.0 V (multi-volt I/O) | — |
| Encapsulado | 356-LBGA (BGA-356), 35 x 35 mm, 1.27 mm pitch | 356-LBGA (FineLine BGA, 35 x 35 mm, 1.27 mm pitch) |
| Operating Temperature Grade | Commercial | — |
| Speed Grade | -1 (fastest commercial bin) | -2 |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| JTAG Support | IEEE Std. 1149.1 boundary scan + ISP | — |
| Lead Free / RoHS | Yes (per -1X suffix) | — |
| Configuration Mode | SRAM-based, ISP via JTAG | — |
| Logic Elements / Cells | — | 9984 |
| Embedded Memory Bits (EAB) | — | 98304 |
| System Gates | — | 200,000 |
| Number of I/O Banks | — | 8 |
| Supply Voltage (Core) | — | 2.5 V (2.375 V - 2.625 V) |
| I/O Voltage (PCI-compatible) | — | 3.3 V / 5.0 V tolerant |
| Propagation Delay | — | 0.4 ns (per datasheet) |
| Temperatura de funcionamiento | — | 0C to +70C (Commercial) |
| Configuration | — | SRAM-based (volatile, requires configuration device) |
| Boundary Scan | — | Yes (JTAG IEEE 1149.1) |
| PLL | — | Yes (on-chip) |
| Estado RoHS | — | Non-compliant (legacy part) |