EPF10K200SBC356-2 vs EPF10K100EBC356-1 Comparación
Comparación detallada lado a lado de EPF10K200SBC356-2 por Altera y EPF10K100EBC356-1 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K200SBC356-2 | EPF10K100EBC356-1 |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $178,00 | $92,00 |
| Series | FLEX 10KS | — |
| Family | FLEX 10KS (Embedded Programmable Logic) | FLEX 10KE |
| Logic Elements / Cells | 9984 | — |
| Logic Array Blocks (LABs) | 1248 | — |
| Embedded Memory Bits (EAB) | 98304 | — |
| System Gates | 200,000 | 100,000 |
| User I/Os | 274 | 274 |
| Number of I/O Banks | 8 | — |
| Supply Voltage (Core) | 2.5 V (2.375 V - 2.625 V) | — |
| I/O Voltage (PCI-compatible) | 3.3 V / 5.0 V tolerant | — |
| Propagation Delay | 0.4 ns (per datasheet) | 0.6 ns |
| Process Technology | 0.22 um CMOS | 0.22 µm CMOS |
| Temperatura de funcionamiento | 0C to +70C (Commercial) | 0 °C to 70 °C |
| Speed Grade | -2 | — |
| Encapsulado | 356-LBGA (FineLine BGA, 35 x 35 mm, 1.27 mm pitch) | 356-LBGA |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration | SRAM-based (volatile, requires configuration device) | — |
| Boundary Scan | Yes (JTAG IEEE 1149.1) | — |
| PLL | Yes (on-chip) | — |
| Estado RoHS | Non-compliant (legacy part) | Unknown - pre-RoHS design |
| Logic Elements | — | 4,992 |
| Embedded Memory | — | 49,152 bits |
| Core Voltage | — | 2.5 V |
| I/O Voltage | — | 2.5 V / 3.3 V |
| Internal Frequency | — | 333.33 MHz |
| JTAG (IEEE 1149.1) | — | Yes |
| Logic Family | — | CMOS |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |